皇冠体育官网



Yun Mao
Ph.D Student
maoyun98@163.com
Modeling and integrated circuit design based on TMDC devicesDongxu Fan
Ph.D Student
DZ1923003@smail.hgtysite.com
IC based on two-dimensional semiconductor

Hao Qiu

associate professor

[email protected]

IC based on two-dimensional semiconductor

Dongxu Fan

Ph.D Student

[email protected]

IC based on two-dimensional semiconductor

Yun Mao

Ph.D Student

[email protected]

Modeling and integrated circuit design based on TMDC devices

Fei Lu

Ph.D Student

[email protected]

IC based on two-dimensional semiconductor



Utilizing the characteristics of two-dimensional semiconductor materials such as high mobility, low power consumption, and high sensitivity to achieve high-performance, low-power, and multifunctional large-scale circuits (LSI). It can overcome many challenges faced by traditional silicon based integrated circuits at the micro and nano scales, and improve the reliability and stability of integrated circuits.

First, construct the EDA toolkit according to the standardized steps to conduct integrated circuit design, and then manufacture large-scale integrated circuits through microelectronic process flow. Most importantly, the two-dimensional semiconductor manufacturing process allows us to attempt to subvert traditional chip construction, such as the design and manufacturing of single chip three-dimensional stacked circuits.